Responsibility

1. Conduct failure analysis(Internal/Customer) to identify failure mode and mechanisms on IC packages and provide recommendations on process and material related issues.

2. Ensure that all assembled products are well qualified to be consistent or even exceeding the internal specification and international standard (JEDEC) requirements.

3. Ensure that all assembled product design, process, material, equipment, site changes are well qualified to be consistent or even exceeding the internal specification and international standard (JEDEC) requirements.

4. Ensure no major process deviations occur in the manufacturing line for the qualified product by executing a regular monitoring (monthly & quarterly based).

5. To provides reliability monitoring/screening tests (daily, weekly) as per customer request to satisfy customer special requirement.

6. To ensure that the new technology/package design is continuously coming out and well qualified to lead the industry development and satisfy our customer forecasting requirement.

7. To provides various reliability tests as per agreement between customer and UDG to improve package performance to satisfy customer requirement.

8. Good knUnderstanding on C/

Requirement

JOB REQUIREMENTS: Essential Skills / Attitude

1.Bachelor¡¯s degree or college on Electronic/Electrical, Chemical /physics

2.Minimum of 8 years experience of failure analysis and reliability in semiconductor industry

3.With good leadership, organizing, planning and interpersonal skills.

4.Problem solving/identification skill.

5.Good knowledge/understanding on C/T-SAM, SEM/EDX, Curve Tracer, decapsulation, XPS,TOF-SIMMS and other surface analysis test