Responsibility£º

1. Able to lead a team of engineers with coaching and guiding engineers/technicians.

2. Leading, driving and initiating improvement activities (yield & cost reduction) with cross functional team in Package Singulation.

3. Guiding engineer on trouble shooting with DOE approach, problem solving, report writing & presentation skills.

4. Interaction with customers.

5. Buildsheet review for engineering package.

6. Package design review, which includes enhancing and improving current package design with modification on current equipment platform.

7. Champion for all package singulation issues that cannot be solved in line level.

8. Provide support on project initiated by others.

Requirement:

1. PhD/Master Degree/Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.

2. Master Degree with over 5years or Bachelor Degree with over 8years working experience in related process in high volume semiconductor manufacturing environment.

3. Strong experience in Package Singulation Process.

4. Strong knowledge in saw blade & UV tape properties and usage.

5. Familiar with tape saw (Disco & KnS) and jig saw (ASM & Hanmi) machine.

6. Independent with minimal supervision.

7. Advanced in microsoft office & microsoft project. Knowledge in autocad would be preferred.

8. SPC/DMAIC.

9. Understand and knowledgeable in DOE application routinely uses it in daily problem solving.

10. Fluent in spoken & good command in written English.

11. Strong knowledge in PFMEA, Control Plan, Process spec, MRB & 8D generation.

12. Well verse with machine operation & tooling design function.