Responsibility£º

1. Perform evaluation and define process parameter for customer lots.

2. Prepare technical report on newly defined parameters & engineering/qualification lot issue.

3. Provide innovative solution to address critical process & material related issue in a timely manner.

4. To communicate and work with colleagues across site on the development of new processes/material for new or existing package.

5. Interaction with customers & suppliers.

6. Buildsheet review.

7. On hold, low yielding and ITR lots disposition for engineering & qualification lots.

8. Provide support on project initiated by others.

Requirement£º

1. Master Degree/Bachelor Degree in Material Science, Applied Physics, Mechanical Engineering or related engineering discipline.

2. Fresh Master Degree/Bachelor Degree/Engineer II with over 3years working experience in high volume electronics manufacturing environment preferably semiconductor.

3. Experience with transfer molding process.

4. Knowledgeable in mold compound properties & mold tool design conceptual.

5. Familiar with either ASM, DaiIchi, Asahi, Towa, Yamada and FICO mold machine.

6. Intermediate in microsoft office & microsoft project. Knowledge in autocad would be preferred.

7. SPC/DMAIC.

8. Understand and knowledgeable in DOE application routinely uses it in daily problem solving.

9. Fluent in spoken & good command in written English & Chinese.

10. Strong knowledge in PFMEA, Control Plan, Process spec, MRB & 8D generation.

11. Well verse with machine operation & tooling design function.