Responsibility£º

1. Conduct and coordinate new products introduce and new project transfer to production.

2. Coordinate with customer and internal side communication.

3. Coordinate internal side job.

4. Provide a regular update on status of the project internally and externally.

5. Provide the Engineering Support to Customer.

Requirement£º

1. Engg degree or equivalent technical course

2. 4-5 years or above experience in semiconductor industry

3. Familiar with IC packaging. This includes equipment and materials

4. Good knowledge and understanding in IC assembly and packaging

5. Good command in spoken and written English / Mandarin

6. Good technical report writing, data analyst interpretation.

7. Effective interpersonal and communication skills

8. Able to work as a team and independently