Responsibility

1 Provide technical support on existing package for customer engagement

2 Develop new package according to market trend and need

3 Drive improvement on existing package MSL capability and BOM

4 Maintain STD BOM and update design rule according to new capability established

5 Coordinate with process development team and drive process capability to maintain market competitiveness

Requirement

1 B.Engineering/Msc

2 Excellent communication and presentation skills (written and verbal).

3 Highly-developed interpersonal and people management/development skills.

4 In depth knowledge of IC manufacturing processes and Packaging

5 Minimum 8 years experience in Package development